Develop ATE test solutions for highly integrated RF SoC ICs for Wireless connectivity devices. Interface with cross functional Design and DFT, PMU, RF DVT teams to develop and present test plans. Design and debug the required device interface boards (DIB) and test program to be used for device characterization, qualification, and production Partner with Product Engineering for product characterization and Reliability testing. Responsible for optimizing test time and yield of the Final Test Program for both FE and BE production releases. Responsible for building multiple sets of correlated production DIBs and transferring to offshore manufacturing sites (OSATs) Resolve early production as well as mass production issues. Provide on-going support for Test Program enhancements as needed to ensure high quality and cost-effective manufacturing throughput Work with cross functional engineering teams in failure analysis and defining corrective actions, ensuring ongoing production quality Builds peer to peer relationships with cross functional teams Experience with developing Multi-site Teradyne UltraFlex and/or Advantest 93K test solutions desired Experience in VB, C, C++, LabView or automation scripting (PERL, PYTHON, or MATLAB) Experience with electronic bench-test equipment - oscilloscopes, logic analyzers, pulse and signal generators, power supplies, DC source/measure Excellent project management skills with demonstrated ability to identify manufacturing improvements, manage change, and implement solutions The ability to organize and present project information and goals in a concise, clear manner Comfortable working in a dynamic team environment Knowledge of RF principles is a plus Effective communication in written and verbal English BE/BTech in Electrical Engineering 12+ years of related experience, or ME/MTech 10+ years of related experiences In India a team of 200 people works on hardware and software development for automotive and chip card security solutions.